Ultrahigh-Density 256-Channel Neural Sensing Microsystem Using TSV-Embedded Neural Probes.

Yu-Chieh Huang,Po-Tsang Huang,Shang-Lin Wu,Yu-Chen Hu,Yan-Huei You,Ming Chen,Yan-Yu Huang,Hsiao-Chun Chang,Yen-Han Lin,Jeng-Ren Duann,Tzai-Wen Chiu,Wei Hwang,Kuan-Neng Chen,Ching-Te Chuang,Jin-Chern Chiou

IEEE Transactions on Biomedical Circuits and Systems（2017）

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摘要

Highly integrated neural sensing microsystems are crucial to capture accurate signals for brain function investigations. In this paper, a 256-channel neural sensing microsystem with a sensing area of 5 × 5 mm 2 is presented based on 2.5-D through-silicon-via (TSV) integration. This microsystem composes of dissolvable μ-needles, TSV-embedded μ-probes, 256-channel neural amplifiers, 11-bit area-powe...

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关键词

Sensors,Through-silicon vias,Probes,Bonding,Parallel processing,Integrated circuit interconnections

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