Performance Enhancement for 14nm High Volume Manufacturing Microprocessor and System on a Chip Processes
2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC)（2016）
Key words
high volume manufacturing microprocessor,system on a chip process,Intel high-performance logic technology interconnects,back end stack,SOC technology,RC performance,intrinsic capacitance,back end metal layers,process versions,metal stacks,size 14 nm
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