Modeling of high power light-emitting diode package integrated with micro-thermoelectric cooler under various interfacial and size effects

•A model of light emitting-diode with micro-thermoelectric cooler is proposed.•Various interfacial and size effects are considered in the presented model.•Five structures of micro-coolers are designed to reduce the chip temperature.•The impact of interfacial effects on the thermal performance is assessed.•The impact of micro-thermoelectric cooler on the optical performance is analyzed.