Electromigration Check: Where the Design and Reliability Methodologies Meet

IEEE Transactions on Device and Materials Reliability(2018)

引用 18|浏览13
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摘要
Due to technology scaling, electromigration (EM) signoff has become increasingly difficult, mainly due to the use of inaccurate methods for EM assessment, such as the empirical Black's model. Results of recent measurements performed on power grid-like structures isolated in the power grid environment have demonstrated that the weak link approach cannot accurately predict lifetime of the power grid...
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关键词
Stress,Power grids,Metals,Integrated circuit interconnections,Current density,Temperature measurement,Reliability
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