Design And Technology Co-Optimization For Exploring Power, Performance, Area And Manufacturability Trade-Offs In Advanced Fdsoi And Finfet Technologies
2018 IEEE 2ND ELECTRON DEVICES TECHNOLOGY AND MANUFACTURING CONFERENCE (EDTM 2018)（2018）
摘要
Advanced Technology Development requires detailed and extensive Design and Technology Co-optimization (DTCO), from device to design to application, to balance system-dependent Power, Performance and Area (PPA) with manufacturabilitv of the technology for steep yield ramp in production. The multi -dimensional exploration and trade-off analysis requires deeper understanding of the process, lithography, device, digital, analog and memory design constraints, as well as application- and system-level implications at a very early stage of technology development. In this paper, we will present the top challenges, mitigation and trade-offs needed to realize an optimized solution in both FDSOI and FinFET Technologies.
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关键词
manufacturability trade-offs,advanced FDSOI,FinFET Technologies,Advanced Technology Development,extensive Design,system-dependent Power,steep yield ramp,trade-off analysis,memory design constraints,system-level implications,optimized solution,analog design constraints,technology co-optimization,design co-optimization,area trade-offs,performance trade-offs,power trade-offs,multidimensional exploration,lithography,application-level implications
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