Cost-efficient Sub-Lithographic Patterning with Tilted-Ion Implantation (TII)

Sangwan Kim,Peng Zheng,Kimihiko Kato,Leonard Rubin,Tsu-Jae King Liu

2018 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA)（2018）

引用 1|浏览30

关键词

tilted-ion implantation,TII,size 10.0 nm,Monte Carlo process simulations,LER,linear hard-mask features,nonlinear hard-mask features,cost-efficient sub-lithographic patterning,line-edge roughness,Moore's Law,sub-lithographic patterning technique

AI 理解论文

溯源树

样例

生成溯源树，研究论文发展脉络

Chat Paper

正在生成论文摘要