Optimization and characterisation of bonding of piezoelectric transducers using anisotropic conductive adhesive

Bonding technology using anisotropic conductive paste shows great promise to achieve the denser integration schemes that are required for the application of high resolution ultrasonic imaging. A design of experiments has been carried out to characterize and optimize a flip-chip bonding technology that utilizes a novel, magnetically aligned anisotropic conductive paste. This optimized process has the potential to implement more reliable and electrically conductive, fine pitch bonding for the production of high density ultrasound transducer arrays in needle devices.