25Gb/s Error-free transmission with a packaged chipset integrating a III-V/SOI DFB laser an electro-absorption modulator and a semiconductor optical amplifier

Ines Ghorbel,Antonin Gallet,Alexandre Shen,David Carrara,D. Make,Guillaume Levaufre,Guang-Hua Duan,S. Olivier,Christophe Jany,Stéphane Malhouitre,Christophe Kopp,Cormac Eason,Peter O'Brien

2017 IEEE 14th International Conference on Group IV Photonics (GFP)（2017）

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摘要

We report on the first hybrid III-V on silicon integration of a DFB laser, an electro-absorption modulator and a semiconductor optical amplifier. We packaged the fabricated chipset and validated the module through 25Gb/s error-free transmissions for short reach communication applications.

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关键词

electro-absorption modulator,semiconductor optical amplifier,silicon integration,error-free transmissions,hybrid III-V-SOI DFB laser,short reach communication applications,Si

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