A study on correlation between near-field EMI scan and ESD susceptibility of ICs

2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)(2017)

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摘要
Correlation between near-field EMI scan and ESD susceptibility scan of a cellphone CPU IC is investigated. It is shown that the ESD susceptibility of the CPU IC depends on the activity of the IC. Based on the obtained correlation between these two scans, it is sufficient to perform the ESD susceptibility scan only by running the application which highly loads the CPU. This reduces the ESD susceptibility measurement time as well as the probability of physical damage to the IC.
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关键词
soft failure,ESD,TLP,EMI
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