Analysis And Characterization Of Interconnect Failure Of Infrared Focal Plane Array

From the 1980s, the flip-chip technology has been successfully used for hybridization of Infrared Focal Plane Array (IRFPA), which leads to a high degree of homogeneity of the indium bumps and therefore very high interconnection efficiency. However, the severe application environment and the large array size bring great challenge to the interconnect reliability. Interconnect failure such as cracking and conglutination of the indium bumps may induces the IRFPA failure and impact on the whole system reliability. Here, we first introduce the flip-chip structure and the hybridization technology of IRFPA. By analyzing the fabrication process and application stress of IRFPA, the mechanisms of the typical interconnect failures including cracking, conglutination and dislocation are then discussed. The techniques to characterize these interconnect failures are further explored and demonstrated.