Interdie Coupling Extraction and Physical Design Optimization for Face-to-Face 3-D ICs

Yarui Peng,Dusan Petranovic,Kambiz Samadi,Pratyush Kamal,Yang Du,Sung Kyu Lim

IEEE Transactions on Nanotechnology（2018）

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摘要

Interdie coupling in face-to-face-bonded three-dimensional (3-D) ICs is becoming increasingly important for power and signal integrity. For the first time, we conduct a comprehensive study of the coupling impact in all three aspects: extraction methodology, physical design, and technology scaling. We conduct detailed sensitivity analysis of key parameters using full-chip 3-D IC designs built acros...

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关键词

Couplings,Three-dimensional displays,Integrated circuits,Bonding,Wires,Metals,Device-to-device communication

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