Cobalt/copper composite interconnects for line resistance reduction in both fine and wide lines

Raghuveer Patlolla
Raghuveer Patlolla
Benjamin D. Briggs
Benjamin D. Briggs
Jing Li
Jing Li
R. Hengstebeck
R. Hengstebeck
G. Lian
G. Lian

international interconnect technology conference, pp. 1-3, 2017.

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Abstract:

Co/Cu composite interconnect systems were studied. Since wide Cu lines require a diffusion barrier which is simultaneously applied also to fine Co lines to reduce Co volume fraction, through-Cobalt Self-Formed-Barrier (tCoSFB) was employed to thin down TaN barrier to u003c1 nm which works as an adhesion layer for Co lines. Line R of fine ...More

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