Cobalt/copper composite interconnects for line resistance reduction in both fine and wide lines
international interconnect technology conference, pp. 1-3, 2017.
Co/Cu composite interconnect systems were studied. Since wide Cu lines require a diffusion barrier which is simultaneously applied also to fine Co lines to reduce Co volume fraction, through-Cobalt Self-Formed-Barrier (tCoSFB) was employed to thin down TaN barrier to u003c1 nm which works as an adhesion layer for Co lines. Line R of fine ...More
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