Reliable airgap BEOL technology in advanced 48 nm pitch copper/ULK interconnects for substantial power and performance benefits

international interconnect technology conference, pp. 1-4, 2017.

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Abstract:

This paper demonstrates the first reliable and low cost airgap BEOL technology, generated at extremely tight dimensions (48 nm pitch) in Cu/ULK. This provides 20% nested-line capacitance reduction relative to the ungapped Cu/ULK baseline. This result is of critical importance, as it validates that airgaps can be extended down to ultrafine...More

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