Manufacturing of selectively buried channel waveguide on glass substrate

A process for selectively buried glass-based planar waveguide chip manufacturing is presented, which involves surface channel waveguide forming, and subsequent field-assisted ion-diffusion with aids of wedge-shaped masking film. Cross-section at different portion of channel waveguide is observed with optical microscope, and waveguide transition loss is characterized. Results show that smooth transition has been realized using wedge-shaped masking film with slope of 1/100, with transition loss of 2.8dB could be achieved.