Skybridge-3D-CMOS: A Fine-Grained 3D CMOS Integrated Circuit Technology

Mingyu Li,Jiajun Shi,Mostafizur Rahman,Santosh Khasanvis,Sachin Bhat,Csaba Andras Moritz

IEEE Transactions on Nanotechnology（2017）

引用 7|浏览39

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摘要

Parallel and monolithic three-dimensional (3-D) integration directions realize 3-D integrated circuits (ICs) by utilizing layer-by-layer implementations, with each functional layer being composed in 2-D. In contrast, vertically composed 3-D CMOS has eluded us likely due to the seemingly insurmountable requirement of highly customized complex routing and regional 3-D doping to form and connect CMOS...

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关键词

Pins,Three-dimensional displays,Routing,Logic gates,Two dimensional displays,Fabrics,Integrated circuits

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