Keynote II: SoX at the edge: The heterogeneous, highly integrated IoT systems of the future

Rumors of Moore's Law demise have been greatly exaggerated! While transistors are not getting simultaneously smaller, faster and lower power every couple of years like for the past several decades, inexorable forces to cram more devices together are still running strong, except that they are now pushing upwards in the third dimension. Heterogeneity, monolithic vs. TSV-based scaling for 3D, and closing the energy loop (cooling and power delivery) will punctuate this talk as it explores the challenges and opportunities that IoT systems of the future face as they move away from planar Systems-on-Chip (SoC) to becoming three dimensional Systems-on-Anything (SoX, e.g. Systems-on-Package, Systems-on-Interposer, etc.).