Parasitic Extraction for Heterogeneous Face-to-Face Bonded 3-D ICs

Yarui Peng,Taigon Song,Dusan Petranovic,Sung Kyu Lim

IEEE Transactions on Components, Packaging and Manufacturing Technology（2017）

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摘要

Face-to-face (F2F)-bonded 3-D ICs provide higher vertical interconnection densities and cost-effective solutions compared to face-to-back-bonded 3-D ICs. With a bumpless direct-copper-bonding process, the die-to-die distance is significantly reduced to enable a finer F2F via pitch. Unfortunately, this increases interdie parasitic components that require careful extraction. Heterogeneous 3-D ICs ar...

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关键词

Integrated circuits,Couplings,Capacitance,Metals,Foundries,Bonding,Device-to-device communication

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