High Density Optical Packaging Of High Radix Silicon Photonic Switches

Tae Joon Seok,Victor I. Kopp,Dan Neugroschl, Johannes Henriksson,Jianheng Luo,Ming C. Wu

2017 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXHIBITION (OFC)（2017）

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摘要

We report on high density optical packaging of high radix (64x64) silicon photonic MEMS switches using pitch-reducing optical fiber array. The footprint of 61-channel optical I/O is as small as 330 mu m x 280 mu m.

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关键词

high-radix silicon photonic switches,high-radix MEMS-actuated silicon photonic switch,Si

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