Important factors affecting the thermal resistance and thermal diffusivity of vapor chambers
Applied Thermal Engineering(2017)
摘要
•Comparison of thermal resistance in vapor chambers under various types of Experiment Setup.•The lowest resistance was observed for VC under constant temperature conditions.•Measurement of thermal diffusivity in vapor chamber using the Angstrom method.•Thermal diffusivity of vapor chamber was 36 times higher than that of copper plate.
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关键词
Vapor chamber,Thermal resistance,Thermal diffusivity,Angstrom method
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