Efficient Measurement of Thermal Coupling Effects on Multichip Light-Emitting Diodes
IEEE Transactions on Power Electronics(2017)
摘要
With the emerging market for multichip module based high-power LED systems, the demand for advanced thermal management techniques has been steadily growing. This paper presents a model developed by the authors for thermal coupling matrix that can calculate temperature distribution at a given heat power of each chip. The model significantly simplifies the task of measuring thermal coupling effect o...
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关键词
Light emitting diodes,Couplings,Temperature measurement,Electronic packaging thermal management,Semiconductor device measurement,Heating,Temperature distribution
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