Effect of Microstructure and Anisotropy of Copper on Reliability in Nanoscale Interconnects

The mechanical behavior of copper is highly anisotropic. Although it is a face centered cubic crystal, the elastic constants vary considerably for different crystallographic orientations. Typically, the copper metal conductor lines in integrated circuits are polycrystalline in nature. In this paper, we utilize Voronoi tessellation to model the polycrystalline microstructure for the copper metal li...