Heterogeneous Interconnect Stitching Technology With Compressible MicroInterconnects for Dense Multi-Die Integration

In this letter, a heterogeneous interconnect stitching technology is proposed. Stitch chips with high-density fine pitch wires are placed between the substrate and the active chips. Fine-pitch microbumps are used to bond the chips and provide high density and low-energy signaling. Compressible microinterconnects (CMIs) are used to compensate for package non-planarity and enable chip-package interc...