3-D Integration and ESD Protection: Design and Analysis

IEEE Transactions on Device and Materials Reliability, pp. 497-503, 2016.

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Keywords:
Electrostatic dischargesThree-dimensional displaysThrough-silicon viasTopologyBondingMore(2+)

Abstract:

A set of design of experiments matrix was created to evaluate the possibilities of electrostatic-discharge (ESD) failures during the complex 3-D integration process as a function of the ESD protection level. A detailed set of pass/fail criteria based on circuit performance was established. Various phases of 3-D integration are monitored f...More

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