Thermo-Plastically Stretchable Electronic And Sensor Circuits

2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)(2016)

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摘要
Conformable electronics, electronics that can be integrated into ergonomically or aesthetically 2.5/3D shape surfaces, have received a tremendous attention during recent years. So far, various materials, designs and fabrication methods were developed for the realization of dynamically-stretchable (elastic) circuits.Besides elastic electronics, there is also a huge number of potential applications for free-form, completely rigid circuits. 3D formed touch devices (smart watches, mobile phones..), smart interior car modules (e.g car consoles or door panels), shaped user interface panels, 3D wiring, antennas and lighting elements are just a few examples of these applications. In this paper, we present a technology for the fabrication of free-form 2.5/3D shaped and rigid circuits. The fabrication process is compatible with typical printed circuit manufacturing and electronics assembly. The starting point for such a circuit is a 2D flat circuit which is converted into its final functional shape using a thermoforming process. This technology will open up an entirely new spectrum of possibilities in electronic circuit design.
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关键词
2.5/3D circuit,stretchable interconnects,thermoplastics,Thermoforming,low-temperature conductive adhesive,copper stiffeners
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