Time-dependent series resistance and implications for voltage acceleration models in BEOL TDDB
international reliability physics symposium, 2016.
A continuous down-scaling of BEOL pitch for advanced process technologies has drastically increased the resistance of Cu interconnects, which brings up a concern of a series resistance effect or IR drop within metal electrode during high voltage TDDB stresses. For accurate TDDB lifetime projections at operating voltages, it is of a critic...More
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