Mass Transport-Induced Failure of Hybrid Bonding-Based Integration for Advanced Image Sensor Applications

Stéphane Moreau,David Bouchu,Viorel Balan, Anne-Lise Le Berrigo,Amandine Jouve,Yann Henrion,Carine Besset,Daniel Scevola,Sandrine Lhostis,Francois Guyader,Emilie Deloffre,Sebastien Mermoz, Julien Pruvost

Electronic Components and Technology Conference（2016）

引用 16|浏览50

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摘要

This paper presents, for the first time, an electromigration study for a hybrid bonding-based integration for advanced image sensor applications. This work demonstrates that the hybrid bonding module has no impact on the electromigration resistance of the present integration. The weakest link is always the BEoL level. There is no hybrid bonding-related failure.

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关键词

Image sensor,3D stack,hybrid bonding,reliability,electromigration

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