Fast Femtosecond Laser Ablation For Efficient Cutting Of Sintered Alumina And Quartz Substrates

Reece N. Oosterbeek,Thomas Ward, Carsten Corazza,Owen Bodley,Simon Ashforth,Andrew Rodda,M. Cather Simpson

2016 CONFERENCE ON LASERS AND ELECTRO-OPTICS (CLEO)（2016）

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摘要

Ultrafast laser machining of ceramic and crystalline substrates offers many benefits versus mechanical dicing. We optimized femtosecond laser parameters for cutting industry sintered alumina and quartz wafers, yielding drastic improvements in cutting speed and quality.

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fast femtosecond laser ablation,sintered alumina substrate,quartz substrate,laser cutting,ultrafast laser machining,ceramic substrates,crystalline substrates,mechanical dicing,optimized femtosecond laser parameters,cutting industry sintered alumina,quartz wafers,cutting speed,cutting quality,Al2O3

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