Pre-liner dielectric nitridation for resistance reduction in copper interconnects

international interconnect technology conference, pp. 89-91, 2016.

Cited by: 0|Views25

Abstract:

Adhesion tests, parametric measurements, and reliability evaluations of an in-situ pre-liner dielectric nitridation process prior to pure Ta liner deposition were carried out, to evaluate the feasibility of reducing via resistance in BEOL Cu/low-k interconnects. Replacing TaN/Ta with Ta in the conventional liner stack reduces Cu via resis...More

Code:

Data:

Get fulltext within 24h
Bibtex
Your rating :
0

 

Tags
Comments