Pre-liner dielectric nitridation for resistance reduction in copper interconnects
international interconnect technology conference, pp. 89-91, 2016.
Adhesion tests, parametric measurements, and reliability evaluations of an in-situ pre-liner dielectric nitridation process prior to pure Ta liner deposition were carried out, to evaluate the feasibility of reducing via resistance in BEOL Cu/low-k interconnects. Replacing TaN/Ta with Ta in the conventional liner stack reduces Cu via resis...More
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