Reliability Analysis for Power Devices Which Undergo Fast Thermal Cycling
IEEE Transactions on Device and Materials Reliability(2016)
摘要
Power devices have to withstand fast thermal cycling in automotive applications. In order to guarantee reliability in these applications, a detailed understanding of the degradation mechanisms is required. One of these mechanisms is interlayer dielectric cracking, caused by the progressive plastic deformation of metal lines. In a previous publication, we have shown that DMOS transistors, with diff...
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关键词
Metals,Transistors,Junctions,Temperature measurement,Integrated circuit reliability,Logic gates
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