Spatial pattern analysis of process variations in silicon microring modulators

2016 IEEE Optical Interconnects Conference (OI)(2016)

引用 5|浏览33
暂无评分
摘要
We identified significant spatial patterns in the wafer-scale process variation data of silicon microring modulators. These spatial patterns implicate some variation sources in certain fabrication process steps.
更多
查看译文
关键词
Process variation,silicon photonics,microring modulator
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要