Modular Test System Architecture for Device, Circuit, and System Level Reliability Testing and Condition Monitoring

APEC 2016 31ST ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION(2017)

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摘要
Reliability stress testing of power semiconductors requires significant development effort for a test apparatus to provide the required functionality. This paper presents a modular test system (MTS) architecture that focuses on flexibility, reusability, and adaptability to future test requirements. Different types of tests for different devices in application circuit configuration can be implement...
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关键词
Stress,Temperature measurement,Aging,Switches,Integrated circuit reliability,Testing
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