Characterization of Composites Prepared with Polyamide-Imide and Alumina Synthesized by Solvothermal Method

PAI (polyamide-imide), composite filled with high thermal conductive inorganic fillers are emerging as a cost-effective means coping with thermal management issues. The properties of these PAI/inorganic composites depend on the nature of the inorganic filler, such as size, shape, phase, and dispersion in the PAI matrix. Thus, in this work, two different kinds of alpha-Al2O3 prepared by solvothermal synthesis with uniform size distribution were chosen as composite fillers in PAI matrix to evaluate the effect of the shape and size of the alpha-Al2O3 on their properties of PAI-alpha-Al2O3 composite. We introduced alpha-Al2O3 particles synthesized by solvothermal method to develop an effective heat conduction pathway in the PAI matrix. When the alpha-Al2O3 synthesized by solvothermal method was used as filler, mechanical properties of PAI-alpha-Al2O3 composite were better than those of commercial alpha-Al2O3. Specially, plate shape alpha-Al2O3 in 400 nm reveals higher thermal conductivity and electrical insulation property than smaller size of alpha-Al2O3 in PAI composite.