Arbitrarily Shaped Rigid and Smart Objects Using Stretchable Interconnections

IEEE Transactions on Components, Packaging and Manufacturing Technology(2016)

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摘要
In this paper, we present the developments of a new technology to realize 2.5-/3-D electronic circuits. The starting point is an electronic circuit embedded in a hard thermoplastic material, which is transformed into a 2.5-/3-D shape using a thermoforming process. The electronic circuit consists of stretchable copper interconnections in combination with electronic components. The circuit is produc...
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关键词
Copper,Integrated circuit interconnections,Heating,Electronic circuits,Thermoforming,Substrates,Lamination
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