Optical Interconnect With Densely Integrated Plasmonic Modulator And Germanium Photodetector Arrays

C. Hoessbacher,Y. Salamin,Y. Fedoryshyn,W. Heni, A. Josten,B. Baeuerle, C. Haffner,M. Zahner, H. Chen,D. L. Elder,S. Wehrli,D. Hillerkuss,D. Van Thourhout,J. Van Campenhout,L. R. Dalton,C. Hafner,J. Leuthold

2016 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXHIBITION (OFC)（2016）

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摘要

We demonstrate the first chip-to-chip interconnect utilizing a densely integrated plasmonic Mach-Zehnder modulator array operating at 3 x 10 Gbit/s. A multicore fiber provides a compact optical interface, while the receiver consists of germanium photodetectors.

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关键词

optical interconnect,germanium photodetector arrays,chip-to-chip interconnect,densely integrated plasmonic Mach-Zehnder modulator array,multicore fiber,compact optical interface,receiver,bit rate 10 Gbit/s,Ge

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