A large surface X-ray camera based on XPAD3/CdTe single chip hybrids

The XPAD3 chip bump-bonded to a Si sensor has been widely used in preclinical micro-computed tomography and in synchrotron experiments. Although the XPAD3 chip is linear up to 60 keV, the performance of the XPAD3/Si hybrid detector is limited to energies below 30 keV, for which detection efficiencies remain above 20%. To overcome this limitation on detection efficiency in order to access imaging at higher energies, we decided to develop a camera based on XPAD3 single chips bump-bonded to high-Z CdTe sensors. We will first present the construction of this new camera, from the first tests of the single chip hybrids to the actual mechanical assembly. Then, we will show first images and stability tests performed on the D2AM beam line at ESRF synchrotron facility with the fully assembled camera.