Csp(3)-Csp(3) Bond-Forming Reductive Elimination From Well-Defined Copper(Iii) Complexes

JOURNAL OF THE AMERICAN CHEMICAL SOCIETY(2019)

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摘要
Carbon-carbon bond-forming reductive elimination from elusive organocopper(III) complexes has been considered the key step in many copper-catalyzed and organocuprate reactions. However, organocopper(III) complexes with well-defined structures that can undergo reductive elimination are extremely rare, especially for the formation of Csp(3)-Csp(3) bonds. We report herein a general method for the synthesis of a series of [alkyl-Cu-III-(CF3)(3)](-) complexes, the structures of which have been unequivocally characterized by NMR spectroscopy, mass spectrometry, and X-ray crystal diffraction. At elevated temperature, these complexes undergo reductive elimination following first-order kinetics, forming alkyl-CF3 products with good yields (up to 91%). Both kinetic studies and DFT calculations indicate that the reductive elimination to form Csp(3)-CF3 bonds proceeds through a concerted transition state, with a Delta H double dagger = 20 kcal/mol barrier.
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关键词
copperiii,complexes,csp<sup>3</sup>–csp<sup>3</sup>,bond-forming,well-defined
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