IBM z14: Enabling physical design in 14-nm technology for high-performance, high-reliability microprocessors.

David Wolpert,Erwin Behnen,Leon J. Sigal,Yuen H. Chan,Gustavo Enrique Téllez, Douglas Bradley,Richard E. Serton, Rajesh Veerabhadraiah, William Ansley, Andrew Bianchi,Nagu Dhanwada,Sungjae Lee,Michael Scheuermann,Glen A. Wiedemeier, John Davis,Tobias Werner,Laura Darden, Keith G. Barkley, Michael Gray,Matthew Guzowski, Mitch DeHond, Timothy Schell, Stelios Tsapepas, Di Phan, Kriti Acharya,Jeffrey A. Zitz,Hunter F. Shi,Christopher J. Berry,James D. Warnock,Michael H. Wood, Robert M. Averill III

IBM Journal of Research and Development（2018）

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摘要

The IBM z14 design was built with the 14-nm high-performance silicon-on-insulator (SOI) technology of GLOBALFOUNDRIES. This was the first technology node after IBM transitioned from its integrated fabrication facility to operating in a fabless environment, driving significant changes to design processes and methodology. In addition to this partnership, the 14-nm technology introduced significant c...

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关键词

Physical design,Microprocessors,Product design

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