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Influence of Sample Preparation on Intrinsic Stresses Inside a Model Chip - First Results of Partial Decapsulation

T. Schaffus,P. Albert, W. Breuer, D. Debie, M. Graml,C. Hollerith, F. Kroninger,W. Mack,H. Pfaff, M. Schaffus,J. Walter

Microelectronics Reliability（2018）

引用 1|浏览8
关键词
Raman spectroscopy,Piezo resistive read out,Intrinsic stress
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