SOT-MRAM 300MM Integration for Low Power and Ultrafast Embedded Memories

2018 IEEE Symposium on VLSI Circuits(2018)

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摘要
We demonstrate for the first time full-scale integration of top-pinned perpendicular MTJ on 300 mm wafer using CMOS-compatible processes for spin-orbit torque (SOT)-MRAM architectures. We show that 62 nm devices with a W-based SOT underlayer have very large endurance (> 5×10 10 ), sub-ns switching time of 210 ps, and operate with power as low as 300 pJ.
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关键词
top-pinned perpendicular MTJ,CMOS-compatible processes,spin-orbit torque-MRAM architectures,sub-ns switching time,SOT-MRAM 300MM integration,ultrafast embedded memories,full-scale integration,low power memories,W-based SOT underlayer
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