Protective nanometer films for reliable Cu-Cu connections.

Tobias Berthold,Guenther Benstetter,Werner Frammelsberger,Manuel Bogner,Rosana Rodríguez,Montserrat Nafría

Microelectronics Reliability（2017）

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摘要

In this work, we report on the protective effect of platinum and carbon based films deposited onto Cu surfaces subject to pre-bonding temperature stress. The protection of Cu surfaces is an important and advantageous procedure to improve the reliability of Cu-Cu connections. The results were obtained from combined non-destructive Scanning Electron Microscopy (SEM) techniques and PeakForce Kelvin Probe Force Microscopy (PF-KPFM).

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关键词

Ion beam sputtering deposition,Copper protection,PeakForce Kelvin probe force microscopy,Scanning electron microscopy,Protective nanometer films

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