29.1 A 64Gb/s 1.4pJ/b NRZ optical-receiver data-path in 14nm CMOS FinFET.

ISSCC(2017)

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摘要
The rapid increase of bandwidth requirements between processors in high-end servers motivates the integration of optical interconnects on the first-level processor package [1]. In this perspective, additional bandwidth density can be achieved by integrating optical transceivers directly into the processor die. Optically enabled CPUs can provide energy-efficient, low-latency interconnects over long distances (u003e10m) in future data-centers. Integrated photonic interconnect technology will require sensitive and low-power receiver (RX) circuits that operate at high data rates.
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关键词
NRZ optical-receiver data-path,CMOS FinFET,optical interconnect integration,high-end servers,bandwidth density,first-level processor package,optical transceivers,processor die,optically enabled CPUs,energy-efficient low-latency interconnects,future data-centers,integrated photonic interconnect technology,low-power receiver circuits,bit rate 64 Gbit/s,size 14 nm
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