Complete CMOS mmW links for consumer volume and cost structure

Joy Laskar, Maja Systems

2017 IEEE Radio and Wireless Symposium (RWS)(2017)

引用 1|浏览13
暂无评分
摘要
Since the first demonstration of 60GHz connectivity in 1895 there has been much interest and promise in the future of mmW gigabit wireless technology. It has been only recently, with the emergence of millimeter wave and sub-THz (up to 300GHz) CMOS based technology and its potential for true monolithic single chip integration that one can envision a new class of systems and applications ranging from ultra-high speed data transmission, video distribution, portable radar, sensing, detection and imaging. In this presentation we focus on the layer 1 radio challenges for deployment of mmW links: co-designed CMOS digital radio with efficient power consumption. Approaches are reviewed which address the high capital cost structure (Capex) and the high operational cost structures (Opex) of mmW gigabit link solutions, bits to antenna. We will also review the market pull and requirements for emerging use cases for mmW gigabit connectivity from 5G to IOT.
更多
查看译文
关键词
IOT,5G,market pull,Opex,operational cost structures,Capex,capital cost structure,co-designed CMOS digital radio,mmW links deployment,layer 1 radio challenges,true monolithic single chip integration,sub-THz CMOS based technology,millimeter wave CMOS based technology,mmW gigabit wireless technology,frequency 60 GHz
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要