Redundant Local-Loop Insertion for Unidirectional Routing.

As the semiconductor manufacturing technology continues to scale down to sub-10 nm, unidirectional layout style has become the mainstream for lower metal layers with tight pitches. Conventional redundant via (RV) insertion for yield improvement has become obsolete because unidirectional routing patterns forbid off-track routing, i.e., wire bending, for the metal coverage of RVs. To enhance the yie...