Power and Thermal Modeling for Communication Systems

2016 IEEE International Workshop on Signal Processing Systems (SiPS)(2016)

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摘要
Power and thermal characteristics have emerged as first-order design goals for all types of semiconductors, including embedded signal and information processing systems. This paper surveys the basic physical principles of power and thermal behavior and argues that statistical models, such as Markov decision processes, are well-suited to the management of power and thermal behavior at both design time and run time.
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关键词
communication systems,power consumption,thermal behavior,VLSI
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