Using CAD Tool for Substrate Parasitic Modeling in Smart Power Technology.

IEEE Transactions on Circuits and Systems I: Regular Papers(2016)

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摘要
Smart Power integrated circuits receive an increasing attraction recently, especially in automotive industry. Substrate noise coupling is one of the major causes of failure in this kind of integrated circuits that requires circuit redesign and increases the overall cost. An exhaustive failure analysis is needed to identify failures due to substrate coupling. In this paper, we present a post-layout...
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关键词
Substrates,Integrated circuit modeling,Solid modeling,Layout,Couplings,Computational modeling
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