A Study of Vertical Thin Poly-Si Channel Transfer Gate Structured CMOS Image Sensors

Sung-Kun Park, Yun-Hui Yang, Cha-Young Lee,Young-Jun Kwon, Tae-Sun Shin, Jae Hyeon Park,Chris Hong,In-Wook Cho,Kyung-Dong Yoo

IEEE Electron Device Letters（2017）

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摘要

In this letter, the image characteristics of CMOS image sensor (CIS) pixels using a vertical thin poly-Si channel (VTPC) transfer gate (TG) are established for the first time. The study of three-dimensional (3D) structures in the image sensor field has been started by 3D Flash memories. By adopting the poly-Si channel fabrication concept of 3D NAND flash memories-appropriately modified to fit the ...

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关键词

Three-dimensional displays,Logic gates,Flash memories,CMOS image sensors,Fabrication,Grain boundaries

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