Encapsulated Organic Package Technology for Wideband Integration of Heterogeneous MMICs
IEEE Transactions on Microwave Theory and Techniques(2017)
摘要
The heterogeneous integration of silicon germanium (SiGe) and gallium arsenide (GaAs) technologies is presented using a novel encapsulated packaging approach with organic laminates. The combination of unique and optimally matched interconnects for each die, and the low-loss nature of the organic substrates, provides wideband performance and system design flexibility. A hybrid receiver front-end is...
更多查看译文
关键词
Wideband,Receivers,Silicon germanium,Gallium arsenide,Laminates,Packaging
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要