A New 3-D Fuse Architecture to Improve Yield of 3-D Memories.

A new 3-D fuse architecture is proposed to improve the yield of 3-D memories. Because the 2-D memories are stacked to form a 3-D memory, the repair status of the prebond is kept as the good status. However, if faults occur in the postbond on the same cells which were repaired in the prebond, they must be identified and repaired because they cannot be repaired by the previous methods. There is no research on the repair the same faulty cells which occur in the prebond and postbond yet. Therefore, the new 3-D fuse architecture is proposed to repair the faulty cells which occur in the prebond and postbond. The redundancies which repair the faulty cells in the prebond are invalidated. The faulty cells are repaired by other redundancies in the postbond by the proposed 3-D fuse architecture. Thus, the proposed technique can improve the yield of 3-D memories. The experimental results show that the proposed technique can achieve higher yields of 3-D memories because only the proposed technique can repair the same faulty cells occurring in the prebond and postbond, and verify the good repair status of the 3-D memories.