Inductive Coupling Effects In Large Tsv Arrays

2015 IEEE International Symposium on Circuits and Systems (ISCAS)(2015)

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摘要
The effects of inductive coupling among TSVs within large TSV arrays are investigated in this paper. A comparison of the equivalent inductance of a paired TSV model and arrayed TSV macromodel is presented for three TSV distribution topologies, grouped, lined, and uniform, within the power network. Modified closed-form expressions are proposed to determine the equivalent inductance of a TSV in these large TSV arrays. Simulation results show that this method achieves hundred times speed improvement as compared to an electromagnetic field solver while maintaining accuracy within 7%.
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关键词
through slilicon vias (TSVs),3-D integrated circuits (3-D ICs),inductive coupling,equivalent inductance
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