Inductive Coupling Effects In Large Tsv Arrays
2015 IEEE International Symposium on Circuits and Systems (ISCAS)(2015)
摘要
The effects of inductive coupling among TSVs within large TSV arrays are investigated in this paper. A comparison of the equivalent inductance of a paired TSV model and arrayed TSV macromodel is presented for three TSV distribution topologies, grouped, lined, and uniform, within the power network. Modified closed-form expressions are proposed to determine the equivalent inductance of a TSV in these large TSV arrays. Simulation results show that this method achieves hundred times speed improvement as compared to an electromagnetic field solver while maintaining accuracy within 7%.
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关键词
through slilicon vias (TSVs),3-D integrated circuits (3-D ICs),inductive coupling,equivalent inductance
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