Three-dimensional packaging for high-performance interconnect in large-scale vlsi systemsANDRÉ DEHON, FRED DRENCKHAHN, THOMAS KNIGHT, HENRY MINSKYInternational Journal of High Speed Electronics and Systems(1996)引用 0|浏览2暂无评分AI 理解论文溯源树样例生成溯源树,研究论文发展脉络